Key internal components include lasers, modulators, photodetectors, drivers, and DSP chips. The industry is currently transitioning from 800G to 1. However, the future lies in CPO. “Localization of optical module chips” refers to China's capability to independently develop and manufacture the core chips and key components used in high-speed optical communication modules, including electrical chips (DSP / Driver / TIA), optical device chips (laser / photodetector), and silicon. Spurred by the AI computing boom and large-scale 5G deployment, optical modules, the critical backbone of communication infrastructure, are undergoing a significant shift towards domestic production in China. Analogy: 📍 Photonic chips are the engine; optical modules are the car. Five Core Areas: A-Share Investors Fully Penetrate the TPU Industry Chain Google's TPU employs a distributed cluster architecture, and every step, from data transmission to power supply and chip packaging, relies heavily on the support of Chinese manufacturing.
[PDF Version]